一、Core Advantage
★ Double groove and roomy glass protection technics,high protection ability;
★ Sipos、Glass、LTO three protection level,increasing the ability in high voltage&temperature;
★ Low stress&graded junction ,increasing avalanche&IR ability.
二、Chip Dimensions
Front View Sectional View1:≤200mil Sectional View2:>200mil
三、Specification
1. SGPP Series 2. RGPP Series