一、Core Advantage
★ The chip uses glass, Sipos (semi insulating polycrystalline silicon), LTO (low temperature oxide) three passivation layer of protection, significantly enhance the product's VC capability and encapsulation;
★ TVS chip is the most advanced technology diffusion, 10V the following products of IR can be controlled within 50UA.
二、Package Dimensions
1. P4KE Package 2. P6KE Package 3. 1.5KE Package 4. SMAJ Package 5. SA Package
三、The product catalog
1. P4KE Series 2. P6KE Series 3. 1.5KE Series 4 .SMAJ Series 5. SA Series