SMA
2014-11-04
一、The core advantages
★ The use of automatic solid crystal machine solid crystal, from process equipment to ensure accuracy, reliability of chip package.
★ The use of screw type dispenser, and fully guarantee the uniformity of solder paste and glue amount, enhance the uniformity of the thickness of the welding tin tin thickness and.
★ The use of monolithic frame + jumper welding structure, from the structure to ensure packaging structure the minimum stress, improve the reliability of the device.
二、Package Dimensions
三、The product catalog
1. GS Series 2. RS Series 3. HS Series 4. ES Series 5. SKY Series
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